ISO DIS 26262-11-2016 道路车辆-功能安全第11部分关于IS026262在半导体应用中的指南

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Road vehicles — Functional safety —

Part 11:

Guideline on application of ISO 26262 to semiconductors

Véhicules routiers — Sécurité fonctionnelle —

Partie 11: titre manque

ICS: 43.040.10

Reference number

ISO/DIS 26262-11:2016(E)

DRAFT INTERNATIONAL STANDARD

ISO/DIS 26262-11

ISO/TC 22/SC 32 Secretariat: JISC

Voting begins on: Voting terminates on:

2016-09-21 2016-12-13

THIS DOCUMENT IS A DRAFT CIRCULATED

FOR COMMENT AND APPROVAL. IT IS

THEREFORE SUBJECT TO CHANGE AND MAY

NOT BE REFERRED TO AS AN INTERNATIONAL

STANDARD UNTIL PUBLISHED AS SUCH.

IN ADDITION TO THEIR EVALUATION AS

BEING ACCEPTABLE FOR INDUSTRIAL,

TECHNOLOGICAL, COMMERCIAL AND

USER PURPOSES, DRAFT INTERNATIONAL

STANDARDS MAY ON OCCASION HAVE TO

BE CONSIDERED IN THE LIGHT OF THEIR

POTENTIAL TO BECOME STANDARDS TO

WHICH REFERENCE MAY BE MADE IN

NATIONAL REGULATIONS.

RECIPIENTS OF THIS DRAFT ARE INVITED

TO SUBMIT, WITH THEIR COMMENTS,

NOTIFICATION OF ANY RELEVANT PATENT

RIGHTS OF WHICH THEY ARE AWARE AND TO

PROVIDE SUPPORTING DOCUMENTATION.

This document is circulated as received from the committee secretariat.

ISO/DIS 26262-11:2016(E)



                  



the requester.



Ch. de Blandonnet 8 • CP 401

CH-1214 Vernier, Geneva, Switzerland

Tel. +41 22 749 01 11

Fax +41 22 749 09 47



www.iso.org

ISO DIS 26262-11:2016(E)

Contents

Foreword................................................................................................................................................................................... 7

Introduction ............................................................................................................................................................................ 8

1. Scope ..........................................................................................................................................................................10

2. Normative references ........................................................................................................................................10

3. Terms and definitions........................................................................................................................................11

4. A semiconductor component and its partitioning ................................................................................11

4.1 How to consider a semiconductor component ................................................................................................ 11

4.1.1 Semiconductor component development......................................................................................................... 11

4.2 Dividing a semiconductor component in parts ............................................................................................... 12

4.3 About hardware faults, errors and failure modes.......................................................................................... 12

4.3.1 Fault models.............................................................................................................................................................. 13

4.3.2 Failure modes ........................................................................................................................................................... 14

4.3.3 The distribution of base failure rate across failure modes ......................................................................... 14

4.4 About adapting a semiconductor component stand-alone analysis at system level ............................ 14

4.5 Intellectual property .............................................................................................................................................. 15

4.5.1 About intellectual property .................................................................................................................................. 15

4.5.2 Category and safety requirements for intellectual property ...................................................................... 18

4.5.3 Intellectual property lifecycle.............................................................................................................................. 20

4.5.4 Work products for intellectual property .......................................................................................................... 22

4.5.5 Integration of black-box intellectual property ............................................................................................... 25

4.6 Base failure rate estimation ................................................................................................................................. 26

4.6.1 About base failure rate estimation ..................................................................................................................... 26

4.6.2 Notes on base failure rate estimation ................................................................................................................ 30

4.6.3 Permanent base failure rate calculation methods ......................................................................................... 32

4.7 Semiconductor dependent failures analysis.................................................................................................... 48

4.7.1 Introduction to DFA ................................................................................................................................................ 48

4.7.2 Relationship between DFA and safety analysis............................................................................................... 49

4.7.3 Dependent failures scenarios .............................................................................................................................. 50

4.7.4 Distinction between cascading failures and common cause failures ....................................................... 53

4.7.5 Dependent failures initiators and mitigation measures .............................................................................. 53

4.7.6 DFA workflow ........................................................................................................................................................... 58

4.7.7 Examples of dependent failures analysis.......................................................................................................... 63

4.7.8 Dependent failures between software element and hardware element ................................................. 63

4.8 Fault injection........................................................................................................................................................... 63

4.8.1 General ....................................................................................................................................................................... 63

4.8.2 Characteristics or variables of fault injection ................................................................................................. 64

4.8.3 Fault injection results ............................................................................................................................................ 66

4.9 Production and Operation .................................................................................................................................... 66

4.9.1 About Production .................................................................................................................................................... 66

4.9.2 Production Work Products ................................................................................................................................... 66

4.9.3 About service (maintenance and repair), and decommissioning .............................................................. 67

4.10 Interfaces within distributed developments ................................................................................................... 67

4.10.1 About distributed development .......................................................................................................................... 67

4.11 Confirmation measures and functional safety audit ..................................................................................... 68

4.12 Clarification on hardware integration and testing ........................................................................................ 68

5 Specific semiconductor technologies and use cases ............................................................................69

5.1 Digital components, memories ............................................................................................................................ 69

5.1.1 About digital components ..................................................................................................................................... 69

5.1.2 Fault models of digital components ................................................................................................................... 69

5.1.3 Detailed fault models of memories..................................................................................................................... 70

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标签： #指南 #ISO #DIS

摘要：

©ISO2016Roadvehicles—Functionalsafety—Part11:GuidelineonapplicationofISO26262tosemiconductorsVéhiculesroutiers—Sécuritéfonctionnelle—Partie11:titremanqueICS:43.040.10ReferencenumberISO/DIS26262-11:2016(E)DRAFTINTERNATIONALSTANDARDISO/DIS26262-11ISO/TC22/SC32Secretariat:JISCVotingbeginson:Votingtermi...

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ISO DIS 26262-11-2016 道路车辆-功能安全第11部分关于IS026262在半导体应用中的指南

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